{"id":5191,"date":"2026-08-04T11:12:52","date_gmt":"2026-08-04T02:12:52","guid":{"rendered":"https:\/\/www.aem.imr.tohoku.ac.jp\/?page_id=5191"},"modified":"2026-08-04T15:03:52","modified_gmt":"2026-08-04T06:03:52","slug":"diamond-wire-saw-musashino-cs-203","status":"publish","type":"page","link":"https:\/\/www.aem.imr.tohoku.ac.jp\/en\/diamond-wire-saw-musashino-cs-203\/","title":{"rendered":"Diamond Wire Saw Musashino CS-203"},"content":{"rendered":"<p><em>*Note: This page was translated by AI from the Japanese original. In case of any discrepancy, the Japanese version shall prevail.*<\/em><\/p>\n<div class=\"equipment-header\" style=\"text-align: center; margin-bottom: 2em;\">\n  <img decoding=\"async\" class=\"aligncenter size-medium\" src=\"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-content\/uploads\/2023\/11\/20231102_115007.jpg\" alt=\"Diamond Wire Saw CS-203 appearance\" style=\"max-width: 100%; height: auto; border-radius: 8px; box-shadow: 0 4px 12px rgba(0,0,0,0.1);\" \/>\n<\/div>\n<h2 style=\"border-bottom: 2px solid #0056b3; padding-bottom: 6px; margin-top: 1.5em; color: #0056b3;\">Overview<\/h2>\n<div style=\"line-height: 1.8; font-size: 1.05em;\">\n<p>The Musashino Electronics <strong>Diamond Wire Saw CS-203<\/strong> is a precision tabletop slicing instrument that utilizes a reciprocating fine diamond-impregnated wire to cut solid materials with minimal mechanical damage and kerf loss.<\/p>\n<p>It provides damage-free, smooth sectioning for single crystals, semiconductors, metals, ceramics, glasses, and composite materials.<\/p>\n<\/div>\n<h2 style=\"border-bottom: 2px solid #0056b3; padding-bottom: 6px; margin-top: 1.5em; color: #0056b3;\">Features<\/h2>\n<ul style=\"line-height: 1.8; padding-left: 1.2em;\">\n<li style=\"margin-bottom: 0.8em;\"><strong>Ultra-Fine Diamond Wire (Minimal Kerf Loss):<\/strong> Uses electroplated diamond wires (diameter 120 \u00b5m to 350 \u00b5m), minimizing material loss and preserving valuable specimens.<\/li>\n<li style=\"margin-bottom: 0.8em;\"><strong>30 m High-Speed Reciprocating Action:<\/strong> Continuous 30 m wire stroke with speeds up to 720 m\/min delivers consistent cutting efficiency.<\/li>\n<li style=\"margin-bottom: 0.8em;\"><strong>Low-Load Precision Feed Control:<\/strong> Fine load adjustment prevents chipping and mechanical stress in fragile or brittle materials.<\/li>\n<li style=\"margin-bottom: 0.8em;\"><strong>Large Work Capacity:<\/strong> Accommodates workpieces up to 125 \u00d7 125 \u00d7 125 mm with a 150 mm table stroke.<\/li>\n<\/ul>\n<h2 style=\"border-bottom: 2px solid #0056b3; padding-bottom: 6px; margin-top: 1.5em; color: #0056b3;\">Specifications<\/h2>\n<div style=\"background-color: #fff9e6; border-left: 4px solid #ff9800; padding: 10px 14px; margin: 1em 0; border-radius: 4px; font-size: 0.95em; line-height: 1.6;\">\n  <strong style=\"color: #d97706;\">[Specification Notice]<\/strong><br \/>\n  Actual equipment configurations or specifications may differ from standard manual specifications. Please consult the equipment manager for details regarding current capabilities and conditions of use.\n<\/div>\n<table style=\"width: 100%; border-collapse: collapse; margin-top: 1em; font-size: 0.95em;\">\n<tbody>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Manufacturer<\/th>\n<td style=\"padding: 10px;\">Musashino Electronics Co., Ltd.<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Model<\/th>\n<td style=\"padding: 10px;\">CS-203 (Precision Diamond Wire Saw)<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Cutting Mechanism<\/th>\n<td style=\"padding: 10px;\">30 m diamond wire high-speed reciprocating action<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Wire Diameters<\/th>\n<td style=\"padding: 10px;\">\u03a6120 \u00b5m to \u03a6350 \u00b5m (electroplated diamond wire)<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Max Wire Speed<\/th>\n<td style=\"padding: 10px;\">720 m\/min<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Max Workpiece Size<\/th>\n<td style=\"padding: 10px;\">125 \u00d7 125 \u00d7 125 mm<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Table Stroke<\/th>\n<td style=\"padding: 10px;\">150 mm<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Primary Purpose<\/th>\n<td style=\"padding: 10px;\">Low-damage sectioning of metals, semiconductors, crystals, and ceramics<\/td>\n<\/tr>\n<tr style=\"border-bottom: 1px solid #e0e0e0;\">\n<th style=\"width: 28%; padding: 10px; background-color: #f8f9fa; text-align: left; font-weight: bold; border-right: 1px solid #e0e0e0;\">Location<\/th>\n<td style=\"padding: 10px;\">Room 1-105<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2 style=\"border-bottom: 2px solid #0056b3; padding-bottom: 6px; margin-top: 1.5em; color: #0056b3;\">Manuals &#038; Guidelines<\/h2>\n<div style=\"background-color: #f0f7ff; border-left: 4px solid #0056b3; padding: 12px 16px; margin-top: 1em; border-radius: 4px; line-height: 1.7;\">\n<p style=\"margin: 0;\"><strong>[Manual (Campus Access Only)]<\/strong><br \/>&#x1f4c4; <a href=\"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-content\/uploads\/2026\/08\/Musashino_Diamond_Wire_Saw_CS203_Manual.pdf\" class=\"mtli_attachment mtli_pdf\" target=\"_blank\" rel=\"noopener noreferrer\">Musashino Diamond Wire Saw CS-203 Owner&#8217;s Manual (PDF, campus access only)<\/a><\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>*Note: This page was translated by AI from the Japanese original. In case of any discrepancy, the Japanese version shall prevail.* Overview The Musashino Electronics Diamond Wire Saw CS-203 is a precision tabletop slicing instrument that utilizes a reciprocating fine diamond-impregnated wire to cut solid materials with minimal mechanical damage and kerf loss. It provides <a href=\"https:\/\/www.aem.imr.tohoku.ac.jp\/en\/diamond-wire-saw-musashino-cs-203\/\" class=\"more-link\">&#8230;<span class=\"screen-reader-text\">  Diamond Wire Saw Musashino CS-203<\/span><\/a><\/p>\n","protected":false},"author":11,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_locale":"en_US","_original_post":"5189","footnotes":""},"class_list":["post-5191","page","type-page","status-publish","hentry","en-US"],"_links":{"self":[{"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/pages\/5191","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/users\/11"}],"replies":[{"embeddable":true,"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/comments?post=5191"}],"version-history":[{"count":4,"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/pages\/5191\/revisions"}],"predecessor-version":[{"id":5279,"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/pages\/5191\/revisions\/5279"}],"wp:attachment":[{"href":"https:\/\/www.aem.imr.tohoku.ac.jp\/wp-json\/wp\/v2\/media?parent=5191"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}