Diamond Wire Saw Musashino CS-203

*Note: This page was translated by AI from the Japanese original. In case of any discrepancy, the Japanese version shall prevail.*

Diamond Wire Saw CS-203 appearance

Overview

The Musashino Electronics Diamond Wire Saw CS-203 is a precision tabletop slicing instrument that utilizes a reciprocating fine diamond-impregnated wire to cut solid materials with minimal mechanical damage and kerf loss.

It provides damage-free, smooth sectioning for single crystals, semiconductors, metals, ceramics, glasses, and composite materials.

Features

  • Ultra-Fine Diamond Wire (Minimal Kerf Loss): Uses electroplated diamond wires (diameter 120 µm to 350 µm), minimizing material loss and preserving valuable specimens.
  • 30 m High-Speed Reciprocating Action: Continuous 30 m wire stroke with speeds up to 720 m/min delivers consistent cutting efficiency.
  • Low-Load Precision Feed Control: Fine load adjustment prevents chipping and mechanical stress in fragile or brittle materials.
  • Large Work Capacity: Accommodates workpieces up to 125 × 125 × 125 mm with a 150 mm table stroke.

Specifications

[Specification Notice]
Actual equipment configurations or specifications may differ from standard manual specifications. Please consult the equipment manager for details regarding current capabilities and conditions of use.
Manufacturer Musashino Electronics Co., Ltd.
Model CS-203 (Precision Diamond Wire Saw)
Cutting Mechanism 30 m diamond wire high-speed reciprocating action
Wire Diameters Φ120 µm to Φ350 µm (electroplated diamond wire)
Max Wire Speed 720 m/min
Max Workpiece Size 125 × 125 × 125 mm
Table Stroke 150 mm
Primary Purpose Low-damage sectioning of metals, semiconductors, crystals, and ceramics
Location Room 1-105

Manuals & Guidelines