*Note: This page was translated by AI from the Japanese original. In case of any discrepancy, the Japanese version shall prevail.*
Overview
The TESCAN AMBER X is a focused ion beam (FIB) system combining an SEM equipped with a high-brightness Schottky electron gun and a dual-beam Xe plasma FIB. Its Ga-free plasma ion source enables high-current, wide-area, high-speed machining.
Equipped with a rocking stage and an OptiLift micromanipulator, it supports micro-sampling and 3D structural analysis via serial sectioning. It also supports TOF-SIMS analysis using the FIB as the primary ion source.
Features
- Dual-Beam Xe Plasma FIB: The Ga-free plasma ion source enables higher-current, wider-area, faster machining than conventional Ga-FIB systems.
- Rocking Stage: Supports observation and machining while rocking (tilting) the specimen.
- OptiLift Micromanipulator: Specimen pickup (micro-sampling) with attitude control.
- TOF-SIMS Analysis: Supports time-of-flight secondary ion mass spectrometry using the FIB as the primary ion source.
- Serial Sectioning (3D Structural Analysis): Reconstructs 3D images from a series of SEM cross-sectional images.
- Protective Coating: Supports Pt and C deposition as a pre-machining protective coating to reduce FIB damage.
- Backscattered Electron Detector & EDS Analysis: Also supports compositional contrast imaging and elemental analysis.
Specifications
Actual equipment configurations or specifications may differ from standard manual specifications. Please consult the equipment manager for details regarding current capabilities and conditions of use.
| Manufacturer | TESCAN (Czech Republic) / Japan distributor: Toyo Corporation |
|---|---|
| Model | AMBER X (Dual-Beam Xe Plasma FIB-SEM) |
| Electron Gun | High-brightness Schottky electron gun (accelerating voltage 0.5–30 kV) |
| Ion Gun | Xe plasma ion gun (accelerating voltage 1–30 kV, beam current 1 pA–3 µA) |
| Protective Coating | Pt and C deposition |
| Specimen Pickup | OptiLift (attitude-controlled micromanipulator) |
| Stage | Rocking stage |
| 3D Reconstruction | Serial sectioning |
| Analysis / Detectors | Backscattered electron detector, EDS, TOF-SIMS (using the FIB as the primary ion source) |
| Max. Specimen Size | 120 mm diameter (max. 1 mm machining width at once) |
| Funding Category | ARIM |
| Location | Room 2-612 |
Manuals & Guidelines
[Manuals & Guidelines]
Manuals are planned for release at a later date and are not yet publicly available. For inquiries regarding instrument use, please contact the equipment manager.